======  XRTC Infrastructure meeting on 2017.08.23 ======
\\

===== Preliminary agenda =====

 General points in Wiki's dashboard:
  - Upcoming Tests - Planning
  - Results from Recent Tests - Analyzing/discussing
  - Common Test Infrastructure - Building
  - XRTC Annual Meeting.
  - Other Activities & Resources

===== MoM =====

==== 1.  Attendees  ====

  - Scott Anderson, (SEAKR)
  - Jennifer Hane, (SEAKR)
  - Mike Wirthlin, (BYU)
  - David Lee, (Sandia)
  - Dan Elftmann, (Xilinx)
  - Cody Dinkins, (Harris)
  - Robért Glein, (Fraunhofer IIS)
  - Alexander Hofmann, (Fraunhofer IIS)
  - Gary Swift, (Swift Engineering and Radiation Services)


==== 2.  Topics covered ====

Discussed background material on Motherboard and other infrastructure materials.\\

Discussed the possibility of sharing boards. We talked about the need to carefully track boards on the wiki. \\

Wiki and GitHub Discussion.
  * We have a public front end. You need a user account to access anything inside of the wiki.
  * Gary is currently giving new user accounts to those that ask. We should start with read access only and then give more permissions as time goes on.
  * Use the wiki to save designs and bit files used in tests, use GitHub for source control management.
  * GitHub: checking in designs, tagging, etc. Who is going to manage/police source control management?

Sam Minger from SEAKR called in. Discuss the connectors in the motherboard. Sam recommended a SAMTEC connector. Discussed pros and cons of SAMTEX and TERADYNE? connector. We have been happy with the mechanical properties of the TERADYNE connector. 
  * SAMTEX connector: [[https://www.samtec.com/connectors/high-speed-board-to-board/high-density-arrays/searay| SEARAY]]. Problems with the SMA - the through hole seems better.
  * Amphenol connector (Nexlev): [[https://www.amphenol.com/markets/medical/connectors/backplane/nexlev|NexLev]]
  * We looked at the daughter card together
    * Holes for mechanical frame, mechanical frame to stiffen board?
    * Holes for FMC spec (both sides). Nylon screws for unmaking of the DUT board
  * Cooling

Discussed a proposed schedule:
  * MB development & DUT Card : Decl 2017
  * Static testing: January 2018
  * Dynamic simple (DSP static): Proton in Feb 2018, HI in March
  * Dynamic complex (DSP and MGT): June 2018
  * Flight IP